Vertical Cavity Surface Emitting Lasers (VCSELs) are a key component in telecom and 3D sensor systems. Applications include datacenters, facial recognition systems, LiDAR time of flight sensors on mobile handsets and also cabin sensing of autonomous vehicles.
Most VCSELs are grown on GaAs substrates, but when dealing with the future challenges, germanium appears to be an excellent candidate to cope with these.
Umicore's germanium wafers offer several key advantages. Their 0 EPD (etch pitch density) ensures better yield and long-term reliability, potentially reducing burn-in for final devices. The transition to larger 8" wafers lowers processing costs and expands capacity, addressing market demand. Unlike GaAs, germanium supports both P-type and N-type applications, enabling alternative VCSEL designs. Additionally, germanium wafers provide greater design flexibility and can be made thinner without compromising performance, enhancing thermal efficiency and reducing the need for back grinding.