Vertical Cavity Surface Emitting Lasers (VCSELs) are a key component in telecom and 3D sensor systems. Applications include data centers, facial recognition systems, LiDAR time of flight sensors on mobile handsets, and also cabin sensing in autonomous vehicles.Â
Most VCSELs are grown on gallium arsenide (GaAs) substrates, but germanium appears to be an excellent candidate for addressing the challenges of the future.
Umicore's germanium wafers offer several advantages. Their zero etch pitch density (EPD) ensures better yield and long-term reliability, potentially reducing burn-in for final devices. The transition to larger 8" wafers lowers processing costs and expands capacity, addressing market demand. Unlike GaAs, germanium supports both p-type and n-type applications, enabling alternative VCSEL designs. Additionally, germanium wafers provide greater design flexibility and can be made thinner without compromising performance, enhancing thermal efficiency and reducing the need for back grinding.
