Umicore successfully develops, manufactures and supplies high-quality coating materials tailored for thin film applications in advanced packaging, compound semiconductors, microsystems and silicon front-end segments. Our range includes specialized electrolytes for electroplating, delivering precise metal deposition essential for today’s microelectronics. We also provide high-performance metal plating solutions for microelectronics and printed circuit boards, addressing the evolving need for new, reliable finishes in increasingly complex electronic devices.