Progress in the functionality and reliability of electronic devices is demanding changes in systems development and integration. Materials, chemicals and auxiliaries are undergoing significant adaptations in performance, cost-efficiency and reliability.

To respond to such needs, Umicore offers innovative patented additives for electroplating with specialized sub-products meeting specific properties and needs. Our copper(II) oxide, along with anode and cathode solutions for electrochemical deposition equipment, enhances our advanced packaging portfolio. 

Our patented IntraCu® additives for copper electroplating, tailored for high-quality, reliable advanced packaging applications. IntraCu® is a modular copper electroplating additive system crafted to meet the high-quality standards of the semiconductor industry, manufactured in a state-of-the-art clean room environment. It acts as a process of record (POR) replacement for key applications such as microbumps in integrated circuit (IC) packages, redistribution layers (RDL) in wafer-level packaging, and copper pillars in flip-chip packaging, featuring a bamboo-like structure, stable tensile strength and excellent resistance to etching.

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